De-bug tools for µ, BGA* Packages

Intel Corp. (Folsom)

Architecture:
Type :
Last Update:

Flash Memory Components Intel(R) StrataFlash(TM) Memory
Packaging Information
4/17/98 5:54:30 PM

Vendor Information

Tool Description:

Intel is in the process of developing an entire line up of de-bug tools and other third party vendor support tools for the µBGA* package.<BR>
<BR>
Many of the current SOP packaging tools can be used for the µBGA package, however, we feel a need to develop µBGA package specific tool categories in order to meet the growing demand for the package and provide complete solutions to our customers.<BR>
<BR>
The attached document outlines just one of many µBGA package tools which are currently under development.

Tool Features:

Aids for easy integration and manufacturing solutions for the µBGA* package.

File Attachments:

flextp3.doc - The attached file is the initial design of the µBGA* package test point fixture which will allow our customers in-circuit access to device test points during product de-bug while mounted on the PCB. This fixture is currently under development.

Supported Device Detail Matrix:

Part & Package

28F320J5 - uBGA-56 ball
28F640J5 - uBGA-56 ball

Vendor Information:

Intel Corp. (Folsom)

1900 Prairie City Road
Folsom , CA 95630
USA

Tech : (916) 356-3104
Email : flash@inside.intel.com
Fax : (916) 356-2803
Toll Free : (800) 628-8686
BBS : (916) 356-3600
URL : http://developer.intel.com

Contact the vendor above for the latest Distributor information

	Part & Package
	28F320J5 - uBGA-56 ball 28F640J5 - uBGA-56 ball